June 12-14, 2018 | Toronto Congress Centre (South Building)
Press Brake Technology | Scott Ottens, Amada America, Inc.
With the advancement of high speed Fiber Lasers the pressure is on the bending area to keep up without expanding department size. Reduction in press brake setup time is critical to do this. The presentation will cover various technologies available for reducing setup time with emphasis on Automatic Tool Changing.
The Benefits of Panel Bending vs. Press Brake Bending | Andrew Jeffery, TRUMPF, Inc.
When it comes to the forming portion of a production line, the first machine that comes to mind is usually a press brake. This is a go-to method for bending material into the part’s final shape or form. What some manufacturers are learning is that there is another viable solution for forming parts: a folding machine. This presentation will discuss the benefits of panel bending vs. press brake bending.
David Schimpff, DuBois Chemicals | Steve Romer, Sames Kremlin
This unique session will highlight examples of real world causes and solutions to common (and less common) finishing defects. Each key area of the finishing process will be covered, including pretreatment, liquid and powder coating materials and liquid and powder application equipment. Attendees will learn the best ways to identify the cause of a finishing defect as it relates to the coating process, and prevent the defect from returning. Presenters will have actual samples of a variety of defects and discuss the problem-solving process on how to correct and eliminate these finishing defects.
Bob Gunst, Jacar Systems LLC
Compact in-die transfer technology is a new and emerging technology in the sheetmetal stamping industry. In this session you will learn the key elements that will help take advantage of this new technology. You will learn from the industry leader about how to apply compact in-die transfer technology to win more work, reduce costs and improve your stamping efficiencies. You will learn valuable transfer tips and tricks, see examples of the different types of compact in-die transfer tools and take away several real-world case studies.
Richard Campbell, Bechtel